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Technical Data 481271850043
"PROGRAM 94"
Free-standing models Range Band C
1. Dimension
Height 85 cm
Width 59,4 cm
Depth 60 cm
Weight 53 kg
Wrapping Shrink film
2. Specification ! PI-Expression
Wafer consumption 19,0 I
Energy consumption 1,5 kW/h
Program step app. 78 min
Noise level:
Range B 52 dB (A)
Range C klo 52 dB (A)
Detergent 25-75 ml
Separate contained chamber 1=113 I1 = 2/3
Salt consumption by 21 ° dh max. 30 gram
Hot wafer connection see type.. 60 °C
Capacity 12 standard plaGe settings
3. Volume
Water
Basic level 1 ,5 I
Working level 2,4 I
Dynamic level app. 4,6 I
Safety level 9,0 I
Overflow-level 12,5 I
Detergent max. 75 gram
Clear rinse 130 cm3
6 Dossier steps 1-6 cm3
Salt container 2 kg
4. Flow Rates !Inlet Volumes
Spray pump 70 I 1 min
Drain pump 16,5 I 1 min
Wafer inlet elctrovalve 5,5 I
5. Water Pressure
Inlet pressure 0,3-10 bar
Spray pump pressure 0,37 bar
6. Rotations
Spray pump motor 2800 r 1 min
Drain pump motor 2800 r 1 min
Spray arm lower 57 j: 7 r 1 min
Spray arm upper 34 j: 6 r 1 min
-J