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PD30500, 30500A, 30500B
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Data Sheet U12031EJ3V0DS00
RECOMMENDED SOLDERING CONDITIONS
Soldering this product under the following soldering conditions is recommended.
For the details of the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For the soldering methods and recommended other than those recommended, consult NEC.
(1) Soldering Conditions of Surface Mount Type
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PD30500S2-150 : 272-pin plastic BGA (29 × 29 mm)
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PD30500S2-180 : 272-pin plastic BGA (29 × 29 mm)
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PD30500S2-200 : 272-pin plastic BGA (29 × 29 mm)
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PD30500AS2-200
Note 1
: 272-pin plastic BGA (29 × 29 mm)
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PD30500AS2-250
Note 1
: 272-pin plastic BGA (29 × 29 mm)
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PD30500BS2-250
Note 1
: 272-pin plastic BGA (29 × 29 mm)
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PD30500BS2-300
Note 1
: 272-pin plastic BGA (29 × 29 mm)
Soldering Method Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.), IR35-103-3
Number of times: 3 times max., Number of days: 3
Note 2
(after that, prebaking is
necessary at 125 °C for 10 hours)
VPS Package peak temperature: 215 °C, Time: 25 to 40 sec max. (200 °C min.), VP15-103-3
Number of times: 3 times max., Number of days: 3
Note 2
(after that, prebaking is
necessary at 125 °C for 10 hours)
Partial heating Pin temperature: 300 °C max., Time: 3 sec max. (per device side) —
Notes 1. Under development
2. Number of days in storage after the dry pack has been opened. The storage conditions are at 25 °C, 65% RH
MAX.
Caution Do not use two or more soldering methods in combination (except partial heating).
(2) Soldering Conditions of Insertion Type
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PD30500RJ-150 : 223-pin ceramic PGA (48 × 48 mm)
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PD30500RJ-180 : 223-pin ceramic PGA (48 × 48 mm)
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PD30500RJ-200 : 223-pin ceramic PGA (48 × 48 mm)
Soldering Method Soldering Conditions
Wave soldering Solder bath temperature: 260 °C max., Time: 10 sec max.,
(Pin only)
Partial heating Pin temperature: 300 °C max., Time: 3 sec max. (Per pin)
Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip directly.