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AD8342 Preliminary Technical Data
Rev. 0 | Page 20 of 20
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
P
I
N
1
I
N
D
I
C
A
T
O
R
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATO
R
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*
1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*
COMPLIANT
TO
JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm x 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions in millimeters
ORDERING GUIDE
Models
Temperature
Package
Package Description
Package
Outline
Branding
Transport Media,
Quanity
AD8342ACPZ-REEL7
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package
[LFCSP_VQ]
CP-16-3 Q01 1,500, Reel
AD8342ACPZ-R2
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package
[LFCSP_VQ]
CP-16-3 Q01 250, Reel
AD8342ACPZ-WP
1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package
[LFCSP_VQ]
CP-16-3 Q01 50, Waffle Pack
AD8342-EVAL Evaluation Board 1
1
Z = Pb-free part.
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
D05352–0–4/05(0)