Filter
Top Products
R
mPGA604 Socket Design Guidelines 3
Contents
1 Introduction ....................................................................................................................... 9
1.1 Objective ................................................................................................................ 9
1.2 Purpose.................................................................................................................. 9
1.3 Scope ..................................................................................................................... 9
2 Assembled Component and Package Description...................................................... 11
2.1 Assembled Component Description..................................................................... 11
2.2 Package Description ............................................................................................ 11
3 Mechanical Requirements.............................................................................................. 13
3.1 Mechanical Supports ........................................................................................... 13
3.2 Materials............................................................................................................... 13
3.2.1 Socket Housing....................................................................................... 13
3.2.2 Color........................................................................................................ 13
3.3 Cutouts for Package Removal ............................................................................. 13
3.4 Socket Standoff Height ........................................................................................ 13
3.5 Markings............................................................................................................... 14
3.5.1 Name....................................................................................................... 14
3.5.2 Lock (Closed) and Unlock (Open) Markings........................................... 14
3.5.3 Lot Traceability........................................................................................ 14
3.6 Socket Size .......................................................................................................... 15
3.7 Socket/Package Translation During Actuation .................................................... 15
3.8 Orientation in Packaging, Shipping and Handling ............................................... 15
3.9 Contact Characteristics........................................................................................ 15
3.9.1 Number of Contacts ................................................................................ 15
3.9.2 Base Material .......................................................................................... 15
3.9.3 Contact Area Plating ............................................................................... 15
3.9.4 Solder Ball Attachment Area Plating.......................................................15
3.9.5 Solder Ball Characteristics...................................................................... 15
3.9.6 Lubricants................................................................................................ 16
3.10 Material and Recycling Requirements .................................................................16
3.11 Lever Actuation Requirements............................................................................. 16
3.12 Socket Engagement/Disengagement Force........................................................ 16
3.13 Visual Aids ...........................................................................................................16
3.14 Socket BGA Co-Planarity..................................................................................... 16
3.15 Solder Ball True Position ..................................................................................... 16
3.16 Critical-to-Function Dimensions........................................................................... 17
4 Electrical Requirements ................................................................................................. 19
4.1 Electrical Resistance............................................................................................20
4.2 Determination of Maximum Electrical Resistance ............................................... 24
4.3 Inductance............................................................................................................ 24
4.3.1 Design Procedure for Inductance Measurements ..................................25
4.3.2 Correlation of Measurement and Model Data Inductance...................... 26
4.4 Pin-to-Pin Capacitance ........................................................................................27
4.5 Dielectric Withstand Voltage................................................................................ 27
4.6 Insulation Resistance........................................................................................... 27
4.7 Contact Current Rating ........................................................................................27