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Environmental Requirements
mPGA604 Socket Design Guidelines 31
5.5 Durability
Use per EIA 364, test procedure 09B. The same package pin field is to be used for 1st and 51st
cycles. Measure contact resistance when mated in 1st and 51st cycles. A spare package pin field is
used for 2nd through 50th cycles. A pair of new package pin fields to be used for each of the socket
samples. The package should be removed at the end of each de-actuation cycle and reinserted into
the socket.