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Table 5-1. Reference Designations, Abbreviations, and Multipliers (2 of 4)
r
DAP-GL Diallyl Phthalate
Glass
DBL Double
DCDR Decoder
DEG
Degree
D-HOLE D-Shaped Hole
DIA Diameter
DIP
Dual In-Line Package
DIP-SLDR Dip Solder
D-MODE Depletion Mode
DO
DP
DP3T
DPDT
DWL
E-R
EXT
F
FC
Package Type
Designation
Deep, Depth, Dia-
metric Pitch, Dip
Double Pole Three
Throw
Double Pole Double
Throw
Dowel1
E
E-Ring
Extended, Extension,
External, Extinguish
F
Fahrenheit, Farad,
Female, Film
(Resistor), Fixed,
Flange, Frequency
Carbon Film/
Composition, Edge
of Cutoff Frequency,
Face
FDTHRU Feedthrough
FEM
Female
FIL-HD
Fillister Head
FL Flash, Flat, Fluid
FLAT-PT Flat Point
FR Front
FREQ
Frequency
ABBREVIATIONS
FT
Current Gain
Bandwidth Product
(Transition
Frequency), Feet,
Foot
FXD Fixed
G
GEN General, Generator
GND Ground
GP
General Purpose,
Group
II
H
Henry, High
HDW Hardware
HEX Hexadecimal,
Hexagon,
Hexagonal
HLCL Helical
HP
Hewlett-Packard
Company, High Pass
I
[C
Collector Current,
Integrated Circuit
ID
Identification,
Inside Diameter
IF
Forward Current,
Intermediate
Frequency
[N
Inch
1NCL
Including
[NT
Integral, Intensity,
Internal
J
J-FET Junction Field
Effect Transistor
JFET
Junction Field
Effect Transistor
K
K
Kelvin, Key,
Kilo, Potassium
KNRLD Knurled
KVDC
Kilovolts
Direct Current
LED
LG
LIN
LK
LKG
LUM
M
MA
MACH
MAX
MC
MET
MHz
MINTR
MIT
MLD
MM
MOM
MTG
MTLC
MW
L
Light Emitting
Diode
Length, Long
Linear, Linearity
Link, Lock
Leakage, Locking
Luminous
M
Male, Maximum,
Mega, Mil, Milli,
Mode
Milliampere
Machined
Maximum
Molded Carbon
Composition
Metal, Metallized
Megahertz
Miniature
Miter
Mold, Molded
Magnetized Material,
Millimeter
Momentary
Mounting
Metallic
Milliwatt
5-4 Replaceable Parts