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ADJUSTMENT
fntroduction
l{
the
lnstrument
performance
is
not
within
specified
requarements
for
a
particular
characteristic,
determine
the
cause,
repair
if necessary,
then
use
the
appropriate
adiustment
procedure
to
retuln
the
instrument
operation
to
.performance
specification.
After
any
adjustment,
verify
performance
by
repeating
that
part;f
the
perfor_
mance
Check.
Allow
the instrum€nt
to
warm
up
for
at
least
one
hour,
in
an ambient
temperature
of
*20"
C
to
+30o
C
FI:*
m.aking
any
adjustments.
Waveform
iilustrations
tn
tne
adrustment
procedure
are
typical
and
may
differ
from
one
instrument
to another:
These
waveforms
should
not
b€
construed
as
being
repres€ntative
of
specift
cation
tolerances.
o
o
a
o
I
o
o
t
o
o
o
o
o
o
o
o
a
o
a
o
o
o
O
O
o
o
o
o
o
o
a
o
t
o
o
a
o
o
o
o
o
o
o
O
Secdon
5
-
4g4Al494Ap
Service
Vot.
1
STANC
DISCHARGE
CAN
DAMAGE
MANY
SEMICONDUCTOR
COMPONENTS
USED
IN
THIS
INSTRUMENT.
Many
semiconductor
components,
esDe-
cially
MOS
types,
can
be
damaged
Oy stitic
discharge.
Damage
may
not
be catas-
trophic
and,
therefore,
not
immediately
appare-nt.
lt
usually
appears
as
a
degrada-
ilon or
the
semiconductor
characteristics.
Devices-lhat
are
particularly
susceptible
are:
MOS,
CMOS,
JFETa,
and
high
impedance
operational
amplifiers
(FET
inp-ut
stag€s.)
The
damaged
parts
may
operate
wttntn
accepted
limits
over
a
short
period,
but
their
reliability
wiil
have
been
severely
impaired.-
Damage
can
be
significanily
reduced
by
observing
the
following
p.ecau-
tions.
1.
Handle
static-sensitive
components
or
circuit
assemblies
at
or on
a
static-free
sur_
face.
Work
station
areas
should
contain
a
static-free
bench
cover
or
work
plane
such
as
conductive
polyethylene
sheeting
and
a
grounding
wrist
strap.
The
work plane
should
be connected
to earth
ground.
2. All
test equipment,
accessories,
and
soldering
tools
should
be connected
to
earth
ground.
3. Minimize
handling
by keeping
the
com_
ponents
in
their
original
containers
until
ready
for
use. Minimize
the
removal
and
installation
of
semiconductors
from
their cir_
cuit
boards.
4.
Hold
the lC
devices
by
their
body
rather
than
the
terminals.
5.
Use
containers
made
of
conductive
material
or
filled
with
conductive
materiat
for
storage
and
transportation.
Avoid
using
ordinary
plastic
containers.
Any
static
sen_
sitive
part
or assembly
(circult
board)
that is
to be
returned
to Tektronix,
lnc.,
should
be
packaged
in
its
original
container
or
one
with
anti-static
packaging
material.
Equipment
Required
Table
5-1
lists
additional
test equipm€nt
and
test
fixtures
recommended
for
the
adjustment
procedure.
Test
equipment
list€d
in
Table
5-1 together
with
those
listed
in
Table
4-1
in
Section
4,
performance
Check are
required
for
the adjustment
procedure.
The characteris_
tics specified
are
the
minimum required
for
the
checks.
Substitute
equipment
must
meet
or
exceed
these
charact€ristics.
5-1